特 点：

1)优良的导热性能；
2)优异的耐热性；
3)高绝缘性能；
4)导磁性；
5)绿色环保；应用领域：

1）用于制作大功率、大电流、高密度、高功耗的电路基板，具有优异的散热性，实现电路组装的高可靠性和长寿命性。
2）用于制作电路与外壳一体化组装，实现电路组装的短、小、轻、薄化。
3）用于制作需要进行导磁回路的电路组装中。如无刷直流微特电机的电路基板。
4）用于制作对于大面积陶瓷基板组装电路困难的电路组装，克服陶瓷基板的脆性，提高可加工性。
5）适合绿色环保电路的组装。
6）其它新型电路组装

FEATURES AND BENEFITS：

1) Good thermal dissipation;
2)Excellent thermal resistance;
3) high insulation;
4)Magneto conductivity properties;
5) green environmental.

APPLICATIONS：

They are suitable for power hybrid boards where thermal and electromagnetic noise is a problem. With excellent mechanical process ability, they can be bent and press-molded for use as three-dimensional printed wiring boards. It is being used in standard and state-of-the-art power supplies with thermal multiplayer boards, and in many other high volume commercial, industrial, military and space products including appliance, automotive, TV deflection, audio power, single-board computers, telecommunication, satellite, and more

主要性能General properties（Testing accord toIPC-4101）