UV CURABLE SOLDER RESIST INK USM-U2 G900

Characteristics of USM-U2 G900

USM-U2 G900 Model is suitable for high-speed printing process because is lower T.I. value prevents smearing caused by the sudden drop of viscosity due to backwards and forwards forces of speedy squeegee applied. Accurate screen printing image with sharp edge and high accuracy can be transferred. Other than these, the characteristics of high S.I.R. and high density contribute to uniform coating, free of blister or void, able to effectively pass through high pot test. Thus especially suitable for use on carbon boards or high-tension voltage loaded boards.

Features

USM-U2 G900