Characteristics of ULF-208-98

LFSOLDER ULF-208-98is a new Pb-free solder paste using very low oxide-level spherical Pb-free solder powder mixed with specially developed high technical Pb-free flux without washing. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, execellent resolution and reliabilitycan also be obtained during continuous printing.

Features

☆. Pb-free (Sn/Ag/Cu series) solder alloy is used.
☆. No chip-side ball occurs.
☆. Excellent in moldability and no slump after printing.
☆. Stable printability is obtained with little change in viscosity during continuous printing.
☆. Excellent printability with fine patterns can be obtained.
☆. Having a good solderability, adequate wettability is shown on various parts.
☆. Same reflow processes can be obtained as Sn/Pb alloy.

Specification

Note:
*Customer special color can be provided.
*Customer package requirements can be satisfied.
*For further information, price and availability, technical data, please contact us by email.