Characteristics of SM、OA、SC series

SM、OA、SC series is a RMA type solder paste which consists high thixotropic flux, and spherical solder powder with little oxide and uniform particle size distribution aimed for improvement of printing property as well. Series which selected thixotropic materials has most suitable low melting temperature for fine pitch surface mount.

Features

☆. No clean-RMA type, copper mirror and silver chromate tests passed.
☆. Excellent for continuous printing , solder balls are not formed after continuous printing.
☆. Fine pitch capability(0.5mm/20mil)(0.4mm/16mil).
☆. Excellent shelf life with minimum change of viscosity.
☆. It hardly slumps, bridging of solder is not recognized after reflow.
☆. Superior solder wettability at soldering, and solder residue is non-corrosive after soldering.
☆. Solder balls are not formed at reflow.
☆. Extremely reliable solder joints.
☆. It has an excellent shelf life and can be stored in room temperature (25℃).
☆. Low flux content.

Note:
*Customer special color can be provided.
*Customer package requirements can be satisfied.
*For further information, price and availability, technical data, please contact us by email.