Characteristics of G4-Ti450A

Ti450A is the latest product of the Non-clean solders paste series produced by nionSoltek, using the RMA flux and mixed with low oxidation spherical Tin powder. High performance thixotropic solvent and specific solvent are used in Ti450A, which has excellent printing and stripping capability. No cleaning is required. It's an epochal product.

Features

☆. Longer shelf life.
☆. No chip-side ball occurs.
☆. Stable printability capability is obtained with little change in viscosity during continuous printing.
☆. Suitable for BGA chip and has no voiding.
☆. Apply for pitch of 0.4mm or fine pitch of 0.3 mm for component SMT process.
☆. Using top grade spherical tin powder from Japanese company, Mitsui.

Specification

Note:
*Customer special color can be provided.
*Customer package requirements can be satisfied.
*For further information, price and availability, technical data, please contact us by email.